Samsung SM421 Pick and Place Machine
▶Samsung SM421 Pick and Place MachineThe Samsung SM421 Pick and Place Machine is a versatile High Speed Mounter designed for fast and precise SMT Placement in modern PCB assembly lines. As a Samsung SM421 system, it combines advanced Flying Vision technology with Precision Placement capabilities to deliver high throughput and reliability.
With a maximum placement speed of 21,000 CPH (chips) and accuracy of ±50 µm (3σ for chips) and ±30 µm for QFP, this Pick and Place Machine ensures consistent quality even with fine-pitch components. The Flying Vision system inspects and aligns components during transfer, while Stage Vision enhances recognition of larger ICs, improving efficiency across all component types.
The Samsung SM421 supports up to 120 feeders, providing flexibility for high mix production, and can handle components from 0603 chips up to 22 × 22 mm ICs with heights up to 6.5 mm. Its Large Board Capability allows PCB sizes up to 460 × 400 mm as standard, with optional extension to 610 × 510 mm for oversized boards. This makes the SM421 suitable for a wide range of SMT Placement tasks in consumer electronics, automotive, and industrial electronics manufacturing.
Engineered as a High Speed Mounter with Precision Placement, the Samsung SM421 Pick and Place Machine reduces cycle time, increases yield, and ensures stable performance under continuous operation. For EMS providers and PCB factories aiming for speed
| Model Name | Samsung SM421 | |
| Alignment |
Flying Vision + Stage Vision (If a large conveyor is installed, only one stage vision can be installed) |
|
| Number of spindles | 6 Spindles × 1 Gantry | |
| Placement Rate | Flying Vision |
Chip 1608 21,000 CPH (IPC9850) SOP 15,000 CPH (IPC9850) QFP 5,500 CPH (IPC9850) |
| Placement Accuracy | Chip/QFP |
Accuracy : ±50@±3σ/Chip (Based on the standard chips) |
| Component | Flying Vision | 0603 ~ 22mm IC |
| Standard Stage Vision (FOV35) |
~32mm IC (Lead Pitch 0.3mm) ~55mm (MFOV) |
|
| Optional Stage Vision (FOV45) |
~42mm IC (Lead Pitch 0.4mm) ~55mm (MFOV) |
|
| Max. Height |
H = 12mm (Flying Camera Standard) H = 12mm (Stage Camera Standard) |
|
| Board Dimension | Minimum | 50(L)*40(W) |
| Single Lane (maximum) |
400mm(L)*400mm(W) 510mm(L)*460mm(W) (Option) 610mm(L)*510mm(W) (Option) |
|
| Dual Lane (maximum) | - | |
| PCB Thickness | 0.38~4.2mm | |
| Feeder Capacity | 120ea/112ea (Docking Cart) | |
| Utility | Power | AC200 / 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase) |
| Max. 4.7kVA | ||
| Air Consumption | 0.5 ~ 0.7MPa (5.1 ~ 7.1kgf/cm2) | |
| 260N/min | ||
| Mass (kg) | Approx. 1,680 | |
| External Dimension (mm) | 1,650(L) x 1,690(D) x 1,535(H) | |
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