PCB paramete | |
Maximum board size(X x Y) | 450mm x 350mm |
Minimum board size(X x Y) | 50mm x 50mm |
PCB thickness | 0.4mm~6mm |
Warpage | ≤1%Diagonal |
Maximum board weight | 6Kg |
Board margin gap | Configuration to 3mm |
Maximum bottom clearance | 20mm |
Transport speed | 1500mm/s(Max) |
Transport height from the ground | 900±40mm |
Transport direction | L-R,R-L,L-L,R-R |
Transport mode | One stage conveyor |
PCB clamping system | Software adjustable(Option:Partial Vacuum Cavity / Whole Vacuum Cavity/PCB Edge) |
Support system | Magnetic Pin/Support Blocks,etc. |
Printing parameters | |
Printing head | Linear motor d。sed loop printing head |
Stencil size | 370mm x 470mm-737 mm x 737 mm |
Maximum printing area(X x Y) | 450mm x 350mm |
Squeegee type | Steel/rubber Squeegee(Angel 45°/50°/60° matching the printing process) |
Squeegee length | 220mm-500mm |
Squeegee height | 65±1mm |
Squeegee thickness | 0.25mm diamond-like carbon Coating |
Printing mode | Single or double printing |
Demoulding length | 0.02 mm - 12 mm |
Printing speed | 0 ~ 200 mm/s |
Printing pressure | 0.5kg - 10Kg |
Printing stroke | ±200 mm (From the center) |
Image parameters | |
(FOV) Field of view | 8mm x 6 mm |
Platform adjustment range | X,Y:±7.0mm,θ:±2.0° |
Mark type | Standard shape benchmark point(SMEMA standard),solder pad/openings |
Camera system | Independent camera,upwards/downwards imaging vision system,geometric matching location |
Performance parameters | |
Repeat position accuracy | ±10.0μm @6 σ,Cpk ≥ 2.0 |
Repetition accuracy | ±25.0μm @6 σ,Cpk ≥ 2.0 |
Cycle time | <7s |
Product change over | <5min |
Equipment | |
Power requirements | AC220V±10%,50/60HZ,15A |
Compressed air requirements | 4~6Kg/cm² Diameter of the tube |
Operating system | Win 7 |
External dimension | 1140mm(L) x 1415mm(W) x 1480mm(H) (Without light,monitor and keyboard) |
Machine weight | Appro.1000Kg |
Temperature and humidity control module(optional) | |
Environment Temperature | 23±3℃ |
Relative humidity | 45~70%RH4 |
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